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19-3116; Rev 0; 12/03
3.2Gbps, Low-Power, Compact, SFP Laser Driver
General Description
The MAX3736 is a compact, +3.3V multirate laser driver for SFP/SFF applications up to 3.2Gbps. The device accepts differential data and provides bias and modulation currents for driving a laser. DC-coupling to the laser allows for multirate applications, and reduces the number of external components. The wide 5mA to 60mA (85mA AC-coupled) modulation current range and 1mA to 100mA bias current make the MAX3736 ideal for driving FP/DFB laser diodes in fiberoptic modules. The laser current setting can be controlled by a current DAC, a voltage DAC, or a resistor. Very low power dissipation, small package size, and reduced component count, make this part an ideal solution for SFP-module applications. The MAX3736 is available in dice or in a small 3mm x 3mm, 16-pin thin QFN package. It operates over a -40C to +85C temperature range.
Features
Fully Compatible with SFP and SFF-8472 Specifications Programmable Modulation Current from 5mA to 60mA (DC-Coupled) Programmable Modulation Current from 5mA to 85mA (AC-Coupled) Programmable Bias Current from 1mA to 100mA 56ps Edge Transition Times 22mA (typ) Power-Supply Current Multirate Operation Up to 3.2Gbps On-Chip Pullup Resistor for DIS 16-Pin, 3mm x 3mm Thin QFN Package
MAX3736
Applications
Gigabit Ethernet SFP/SFF Transceiver Modules 1G/2G Fibre-Channel SFP/SFF Transceiver Modules Multirate OC-3 to OC-48 FEC SFP/SFF Transceiver Modules 10G Ethernet LX-4 Modules
PART MAX3736E/D MAX3736ETE
Ordering Information
TEMP RANGE -40C to +85C -40C to +85C PIN-PACKAGE Dice* 16 Thin QFN
*Dice are designed to operate from -40C to +85C, but are tested and guaranteed only at TA = +25C. Pin Configuration appears at end of data sheet.
Typical Application Circuit
HOST BOARD HOST FILTER VCC_RX VCC SUPPLY FILTER 15 56 0.01F SFP OPTICAL TRANSMITTER +3.3V
0.1F 50 SERDES 50 0.1F INBC_MON IN+
OUT-
8.2pF 10
MAX3736
MODSET BIASSET
OUT+ BIAS FERRITE BEAD GND
TX_DISABLE MOD-DEF1 MOD-DEF2
DIS
LASER CONTROLLER
________________________________________________________________ Maxim Integrated Products
1
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3.2Gbps, Low-Power, Compact, SFP Laser Driver MAX3736
ABSOLUTE MAXIMUM RATINGS
Power-Supply Voltage VCC ..................................-0.5V to +6.0V Voltage at IN+, IN-, DIS..........................-0.5V to (VCC + 0.5V) Voltage at BC_MON, MODSET, BIASSET .............-0.5V to +3.0V Voltage at OUT+, OUT-.........................+0.5V to (VCC + 1.5V) Voltage at BIAS ....................................+0.5V to (VCC + 0.5V) Current into BIAS, OUT+, OUT- ......................-20mA to +150mA Current into IN+, IN-....................................-20mA to +20mA Continuous Power Dissipation (TA = +85C) 16-Pin Thin QFN (derate 25mW/C above +85C) .............2W Operating Junction Temperature Range ..........-55C to +150C Storage Temperature Range .............................-55C to +150C Die Attach Temperature ..................................................+400C Lead Temperature (soldering, 10s) .................................+300C
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VCC = +2.97V to +3.63V, TA = -40C to +85C. Typical values are at VCC = +3.3V, IBIAS = 20mA, IMOD = 30mA, TA = +25C, unless otherwise noted.) (Note 1)
PARAMETER Power-Supply Current I/O SPECIFICATIONS Differential Input Voltage Common-Mode Input Voltage Differential Input Resistance DIS Input Pullup Resistance DIS Input Current DIS Input High Voltage DIS Input Low Voltage BIAS GENERATOR Bias Current Range Bias Off-Current BIASSET Current Gain BIASSET Current Gain Stability BIASSET Current Gain Linearity Bias Overshoot Bias-Current Monitor Gain Bias-Current Monitor Gain Stability (Notes 4, 5) IBIAS IBIASOFF GBIAS Current into BIAS pin Current into BIAS pin, DIS asserted high (Note 3) 5mA IBIAS 10mA 10mA IBIAS 100mA 70 79 -4.4 -2.3 85 85 1 100 100 95 91 +4 +2.3 10 13.7 -7 -5 5 5 mA A A/A % % % mA/A +7 +5 60 mAP-P 85 % VIH VIL VID VINCM RIN RPULL VDIS = VCC VDIS = GND, VCC = 3.3V, RPULL = 7.4k 2.0 0.8 -450 85 4.7 VID = VIN+ - VIN-, Figure 1 0.2 0.6 x VCC 100 7.2 115 10.0 15 2.4 VP-P V k A V V SYMBOL ICC CONDITIONS Excludes the laser bias and modulation currents (Note 2) MIN TYP 22 MAX 35 UNITS mA
10mA IBIAS 100mA (Note 4) 10mA IBIAS 100mA (Note 5) During SFP module hot plugging; see Figure 3 (Notes 5, 6) (Note 5) 1mA IBIAS 5mA 5mA IBIAS 10mA 10mA IBIAS 100mA Current into OUT+, RL = 15, VOUT+ and VOUT- 0.6V (DC-coupled) Current into OUT+, RL = 15, VOUT+ and VOUT- 2.0V (AC-coupled)
|4| |2.8| |2.4|
Modulation Current Range
IMOD
2
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3.2Gbps, Low-Power, Compact, SFP Laser Driver
ELECTRICAL CHARACTERISTICS (continued)
(VCC = +2.97V to +3.63V, TA = -40C to +85C. Typical values are at VCC = +3.3V, IBIAS = 20mA, IMOD = 30mA, TA = +25C, unless otherwise noted.) (Note 1)
PARAMETER MODULATOR Modulation Current Gain Modulation Current Gain Stability Modulation Current Gain Linearity GMOD (Note 3) 5mA IMOD 10mA 10mA IMOD 85mA 70 79 -4.4 -3.3 2.3 0.1 0.1 0.1 0.1 48 58 16 17 30 6.3 0.6 1 ps psRMS 1.4 1 1 1 100 80 80 38 38 psP-P A ps ps % 85 85 95 91 +4 +3.3 A/A % % SYMBOL CONDITIONS MIN TYP MAX UNITS
MAX3736
10mA IMOD 85mA (Notes 4, 5) 10mA IMOD 85mA (Note 5) IBIASSET = 0.15mA; IMODSET = 0.7mA IBIASSET = IMODSET = 0.15mA IBIASSET = IMODSET = 0.4mA IBIASSET = IMODSET = 0.6mA IBIASSET = IMODSET = 0.9mA IMODOFF tR tF DIS asserted high 20% to 80%; 10mA IMOD 60mA (Note 5) 80% to 20%; 10mA IMOD 60mA (Note 5) 10mA IMOD 60mA; 2.67Gbps; 223-1 PRBS 10mA IMOD 60mA; 3.2Gbps; K28.5 pattern 10mA IMOD 60mA; 155Mbps; 223-1 PRBS 10mA IMOD 60mA; 3.2Gbps; K28.5; TA = +100C
Bias Current Gain and Modulation Current Gain Matching (Notes 5, 7)
Modulation OFF Current Rise Time Fall Time
Deterministic Jitter (Notes 5, 8)
Random Jitter
10mA IMOD 60mA (Note 5)
Note 1: Specifications at -40C are guaranteed by design and characterization. Dice are tested at TA = +25C only. Note 2: Maximum value is specified at IMOD = 60mA and IBIAS = 100mA. BC_MON connected to VCC. Note 3: Modulation current gain, GMOD, is defined as GMOD = IMOD / IMODSET. Bias current gain, GBIAS, is defined as GBIAS = IBIAS / IBIASSET. The nominal gain is measured at VCC = +3.3V and TA = +25C. Note 4: Gain stability is defined as [(Gain) - (Nom_Gain)] / (Nom_Gain) over the listed current range, temperature, and supply variation. Nominal gain is measured at VCC = +3.3V, TA = +25C. The voltage at the BC_MON pin must not exceed 1.39V. Note 5: Guaranteed by design and characterization; see Figure 2. Note 6: VCC turn-on time must be less than 0.8s, DC-coupled interface. Note 7: The gain matching is defined as ABS [(GMOD/GBIAS - GMODNOM/GBIASNOM)/(GMODNOM/GBIASNOM)] over the specified temperature and voltage supply range. Note 8: For supply noise tolerance, noise is added to the supply (100mVP-P) up to 2MHz; see Figure 3.
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3.2Gbps, Low-Power, Compact, SFP Laser Driver MAX3736
VOLTAGE VIN+ VIN(VIN+) - (VIN-) 200mVP-P MIN 2400mVP-P MAX CURRENT IOUT+
IMOD
100mV MIN 1200mV MAX OUT-
VCC 25 26
VCC
30
MAX3736
OUT+
1.1pF OSCILLOSCOPE IOUT+ 130 50
Figure 1. Definition of Single-Ended Input Voltage Range
Figure 2. Output Termination for Characterization
SOURCE NOISE VOLTAGE SUPPLY
HOST BOARD FILTER DEFINED BY SFP MSA 1H 0.1F 10F 0.1F
MODULE TO LASER DRIVER VCC OPTIONAL OPTIONAL
Figure 3. Supply Filter
Typical Operating Characteristics
(Typical values are at VCC = 3.3V, IBIAS = 20mA, IMOD = 30mA, TA = +25C, unless otherwise noted.)
OPTICAL EYE (155Mbps)
MAX3736 toc01
OPTICAL EYE (2.488Gbps)
MAX3736 toc02
ELECTRICAL EYE (2.488Gbps)
1870MHz FILTER 223 - 1 PRBS
MAX3736 toc03
117 MHz FILTER, 231 - 1 PRBS 1310nm FP LASER
ER = 8.2dB, OC-48 FILTER 231 - 1 PRBS, 1310 FP LASER
C4
919ps/div
58ps/div
58ps/div
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3.2Gbps, Low-Power, Compact, SFP Laser Driver MAX3736
Typical Operating Characteristics (continued)
(Typical values are at VCC = 3.3V, IBIAS = 20mA, IMOD = 30mA, TA = +25C, unless otherwise noted.)
SUPPLY CURRENT vs. TEMPERATURE
MAX3736 toc05
BIAS CURRENT MONITOR GAIN vs. TEMPERATURE
MAX3736 toc06
MODULATION CURRENT vs. MODSET RESISTANCE (ZL = 15)
70 60 IMOD (mAP-P) 50 40 30 20 10
MAX3736 toc07
80 EXCLUDES IBIAS AND IMOD 70 SUPPLY CURRENT (mA) 60
20
80
18 GAIN (mA/A)
50 40 30 20 10 -40 -15 10 35 60 85 TEMPERATURE (C)
16
14
12
10 -40 -15 10 35 60 85 TEMPERATURE (C)
0 1 10 RMODSET (k) 100
BIAS CURRENT vs. BIAS RESISTANCE
MAX3736 toc08
EDGE TRANSITION TIME vs. MODULATION AMPLITUDE
MAX3736 toc09
100 90 80 70 IBIAS (mA) 60 50 40 30 20 10 0 1 10 RBIASSET (k)
80 70 EDGE TRANSITION TIME (ps) FALL TIME 60 50 40 30 20 10 RISE TIME
100
10
20
30
40
50
60
IMOD (mA)
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3.2Gbps, Low-Power, Compact, SFP Laser Driver MAX3736
Typical Operating Characteristics (continued)
(Typical values are at VCC = 3.3V, IBIAS = 20mA, IMOD = 30mA, TA = +25C, unless otherwise noted.)
DETERMINISTIC JITTER vs. MODULATION CURRENT
2.7Gbps 223-1 PRBS
MAX3736 toc10
DIFFERENTIAL S11 vs. FREQUENCY
MAX3736 toc11
60 50 40 DJ (psP-P)
0 -5 -10 IS11I (dB) -15 -20 -25 -30
30 20 10 0 10 20 30 40 50 60 IMOD (mAP-P)
0
2
4
6
8
10
FREQUENCY (GHz)
Pin Description
PIN 1, 4, 9, 12, 15 2 3 5 6 7 8 10 11 13, 14 16 EP NAME VCC IN+ INBIASSET MODSET BC_MON BIAS OUT+ OUTGND DIS Exposed Pad FUNCTION +3.3V Supply Voltage. All pins must be connected to VCC. Noninverted Data Input Inverted Data Input A current DAC, a voltage DAC, or a resistor, connected from this pin to ground, sets the desired bias current for the laser (see the Programming the Laser Bias Current section). A current DAC, a voltage DAC, or a resistor, connected from this pin to ground, sets the desired bias current for the laser (see the Programming the Laser Modulation Current section). Bias Current Monitor Output. Current out of this pin develops a ground-referenced voltage across an external resistor that is proportional to the bias current. Laser Bias Current Output Noninverted Modulation Current Output. IMOD flows into this pin when input data is high. Inverted Modulation Current Output. IMOD flows into this pin when input data is low. Ground Transmitter Disable, TTL. Laser output is disabled when DIS is asserted high or left unconnected. The laser output is enabled when this pin is asserted low. Ground. Must be soldered to the circuit board ground for proper thermal and electrical performance (see the Exposed Pad Package section).
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3.2Gbps, Low-Power, Compact, SFP Laser Driver MAX3736
DIS VCC VCC
82pF
16k
7.2k
OUT+ 24k 50 IN+ 50 OUT-
INBIAS VCC x1 x85
VCC
VCC
x85
BC_MON 1.2V 1.2V
MAX3736
BIASSET
MODSET
Figure 4. Functional Diagram
Detailed Description
The MAX3736 laser driver consists of three operational blocks: a bias current generator, a modulation current generator, and a high-speed modulation path. The laser-biasing block includes a monitor output for biassensing purposes. Both the bias and modulation generating blocks are enabled and disabled by the DIS pin. The high-speed modulation path provides a 100 differential input resistance.
Bias Current Monitor
The MAX3736 features a bias current monitor (BC_MON). This monitor is realized by mirroring a fraction of the bias current and developing a voltage across an external resistor connected to ground. For example, connecting a 100 resistor to ground gives the following relationship: VBC_MON = (IBIAS / 73) x 100. For compliance, the voltage on BC_MON must be kept below 1.39V.
Bias Current Generator
To maintain constant average optical power, the MAX3736 is designed to interface to a laser controller IC. The laser controller IC controls the MAX3736, and maintains a constant laser power using an automatic power-control (APC) circuit. A back-facet photodiode, mounted in the laser package, is used to convert the optical power into a photocurrent. The laser controller IC adjusts the laser bias current so the monitor photodiode's current matches the level programmed by the user. It does this by adjusting the current sourced by the MAX3736's BIASSET pin. The MAX3736 reacts by increasing or decreasing the laser current at BIAS.
Modulation Current Generator
The laser's modulation amplitude can be controlled by placing a resistor from MODSET to ground. To set the modulation amplitude, see the I MOD vs. R MODSET graph in the Typical Operating Characteristics. A more advanced control scheme employs the use of a laser controller IC to control modulation current to stabilize the extinction ratio. For more information on controlling the extinction ratio refer to Maxim Application Note HFAN-02.3.1: Maintaining Average Power and Extinction Ratio, Part 1, Slope Efficiency and Threshold Current.
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3.2Gbps, Low-Power, Compact, SFP Laser Driver MAX3736
High-Speed Modulation Driver
The output stage is composed of a high-speed differential pair and a programmable modulation current source. The MAX3736 is optimized for driving a 15 load; the minimum instantaneous voltage required at OUT+ is 0.6V. Modulation current swings up to 60mA are possible. To interface with the laser diode, a damping resistor (RD) is required for impedance matching. The combined resistance of the series damping resistor and the equivalent series resistance of the laser diode should equal 15. To reduce optical output aberrations and duty-cycle distortion caused by laser diode parasitic inductance, an RC shunt network might be necessary. Refer to Maxim Application Note HFAN 02.0: Interfacing Maxim's Laser Drivers to Laser Diodes for more information. At high data rates, e.g., 2.5Gbps, any capacitive load at the cathode of a laser diode degrades optical output performance. Because the BIAS output is directly connected to the laser cathode, minimize the parasitic capacitance associated with the pin by using an inductor to isolate the BIAS pin parasitics from the laser cathode. In the absence of input data, the modulation current switches to OUT-, squelching the transceiver output. To program the laser modulation current using a voltage DAC, attach the DAC to the MODSET pin through a series resistor, RSERIES, and set the current using the following equation: IMOD = 1.2V - VDAC x 85 RSERIES
To program the laser modulation current using a resistor, place the resistor from MODSET to ground. IMOD current can be calculated by the following equation: IMOD = 1.2V x 85 RMODSET
Programming the Bias Current
There are three methods for setting the bias current on the MAX3736 laser driver. The current can be set by using a current DAC, a voltage DAC in series with a resistor, or by using a resistor connected to GND. To program the laser bias current using a current DAC, attach the DAC to the BIASSET pin and set the current using the following equation: IBIAS = IBIASET x 85 To program the laser bias current using a voltage DAC, attach the DAC to the BIASSET pin through a series resistor, RSERIES, and set the current using the following equation: IBIAS = 1.2V - VDAC x 85 RSERIES
Disable
The DIS pin disables the modulation and bias current. The typical enable time is 2s for bias current and 1s for modulation current. The typical disable time is 200ns for bias current and 250s for modulation current. The DIS pin has a 7.4k internal pullup resistor.
Design Procedure
Programming the Modulation Current
There are three methods for setting the modulation current on the MAX3736 laser driver. The current can be set by using a current DAC, a voltage DAC in series with a resistor, or by using a resistor connected to GND. To program the laser modulation current using a current DAC, attach the DAC to the MODSET pin and set the current using the following equation: IMOD = IMODSET x 85
To program the laser bias current using a resistor, place the resistor from BIASSET to ground. IBIAS current can be calculated by the following equation: IBIAS = 1.2V RBIASET x 85
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3.2Gbps, Low-Power, Compact, SFP Laser Driver MAX3736
VCC VCC
MAX3736
82pF PACKAGE IN+ 0.11pF 50 0.65nH 0.11pF 0.43nH OUT+ 0.11pF VCC 50 IN0.11pF 0.65nH 24k VCC 16k
MAX3736
PACKAGE 0.43nH OUT-
Figure 5. Simplified Input Circuit Schematic
Figure 6. Simplified Output Circuit Schematic
Input Termination Requirements
The MAX3736 data inputs are SFP MSA compliant. Onchip 100, differential input impedance is provided for optimal termination (Figure 5). Because of the on-chip biasing network, the MAX3736 inputs self-bias to the proper operating point to accommodate AC-coupling.
tion current can be programmed from 5mA to 85mA. Refer to Maxim Application Note HFAN 02.0: Interfacing Maxim's Laser Drivers to Laser Diodes for more information on AC-coupling laser drivers to laser diodes.
Interface Models
Figures 5 and 6 show simplified input and output circuits for the MAX3736 laser driver. If dice are used, replace package parasitic elements with bondwire parasitic elements.
Applications Information
Data Input Logic Levels
The MAX3736 is directly compatible with +3.3V reference CML. Either DC or AC-coupling can be used for CML referenced to +3.3V. For all other logic types, AC-coupling should be used. DC coupling to CML is fine, but it negates the squelching function on the modulation path.
Wire-Bonding Die
The MAX3736 uses gold metalization with a thickness of 5m (typ). Maxim characterized this circuit with goldwire ball bonding (1-mil diameter wire). Die-pad size is 94 mils (2388m) square, and die thickness is 15 mils (381m). Refer to Maxim Application Note HFAN08.0.1: Understanding Bonding Coordinates and Physical Die Size for additional information.
Modulation Currents Exceeding 60mA
For applications requiring a modulation current greater than 60mA, headroom is insufficient for proper operation of the laser driver if the laser is DC-coupled. To avoid this problem, the MAX3736 modulation output can be AC-coupled to the cathode of a laser diode. An external pullup inductor is necessary to DC-bias the modulation output at VCC. Such a configuration isolates laser forward voltage from the output circuitry and allows the output at OUT+ to swing above and below the supply voltage (VCC). When AC-coupled, the MAX3736 modula-
Layout Considerations
To minimize loss and crosstalk, keep the connections between the MAX3736 output and the laser as short as possible. Use good high-frequency layout techniques and multilayer boards with an uninterrupted ground plane to minimize EMI and crosstalk.
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3.2Gbps, Low-Power, Compact, SFP Laser Driver MAX3736
Exposed-Pad Package
The exposed pad on the 16-pin QFN provides a very low thermal resistance path for heat removal from the IC. The pad is also electrical ground on the MAX3736 and must be soldered to the circuit board ground for proper thermal and electrical performance. Refer to Maxim Application Note HFAN-08.1: Thermal Considerations for QFN and Other Exposed-Pad Packages for additional information.
TOP VIEW
Pin Configuration
GND 14 GND 13 12 VCC 11 OUT10 OUT+ 9 5 BIASSET 6 MODSET 7 BC_MON 8 BIAS VCC VCC 15 DIS 16 VCC IN+ INVCC 1 2 3 4
Laser Safety and IEC 825
Using the MAX3736 laser driver alone does not ensure that a transmitter design is compliant with IEC 825. The entire transmitter circuit and component selections must be considered. Customers must determine the level of fault tolerance required by their application. Please recognize that Maxim products are not designed or authorized for use as components in systems intended for surgical implant into the body, for applications intended to support or sustain life, or for any other application where the failure of a Maxim product could create a situation where personal injury or death may occur.
MA3736
THIN QFN (3mm x 3mm)
THE EXPOSED PAD MUST BE CONNECTED TO GROUND FOR PROPER THERMAL AND ELECTRICAL PERFORMANCE
Chip Topography/ Pad Configuration
The origin for pad coordinates is defined as the bottom left corner of the bottom left pad. All pad locations are referenced from the origin, and indicate the center of the pad where the bond wire should be connected. Refer to Maxim Application Note HFAN-08.0.1: Understanding Bonding Coordinates and Physical Die Size for detailed information. TRANSISTOR COUNT: 1385 PROCESS: SiGe BIPOLAR SUBSTRATE CONNECTED TO GND DIE THICKNESS: 15 mils
Chip Topography
GND DIS VCC GND GND GND VCC VCC IN+ INVCC OUTOUT1.14mm OUT+ (45mils) OUT+ VCC (0,0) BIASSET MODSET BC_MON 1.55mm (61mils) BIAS
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3.2Gbps, Low-Power, Compact, SFP Laser Driver
Bonding Coordinates
Table 1. MAX3736 Bondpad Locations
PAD NUMBER BP1 BP2 BP3 BP4 BP5 BP6 BP7 BP8 BP9 BP10 BP11 BP12 BP13 BP14 BP15 BP16 BP17 BP18 BP19 BP20 PAD NAME VCC IN+ INVCC BIASSET MODSET BC_MON BIAS VCC OUT+ OUT+ OUTOUTVCC GND GND GND VCC DIS GND COORDINATES (m) X 0 0 0 0 298.3 526.5 737.7 1104.8 1258.9 1258.9 1258.9 1258.9 1258.9 1258.9 1060 896.1 712.7 550.3 378.1 191.8 Y 520.8 351.4 169.4 0 -222.1 -222.1 -223.5 -224.9 -107.9 32.1 179.1 342.9 490 629.9 630.9 632.3 630.9 630.9 631 630.9
Package Information
For the latest package outline information, go to www.maxim-ic.com/packages.
MAX3736
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 11 (c) 2003 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.

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